Epoxy Resins, Hardeners, Glues & Fillers

WEST System 411 Microsphere Blend is a low density filler which cures to a lightweight filling putty with excellent filling characteristics. Also used as a low density adhesive for edge gluing in strip plank construction. Mix with WEST System Epoxy to...

WEST SYSTEM 410 MICROLIGHT is the ideal low-density filler for creating a light, easily-worked fairing compound especially suited for cosmetic or surface applications like shaping, filling or fairing. Mixes with WEST System epoxy resin to a very smooth...

WEST System 413 (previously know as 403) is a high density filler used to create a multi-purpose, high strength adhesive for structural applications like bonding, filleting and hardware bonding. Use 413 in conjunction with mixed WEST System epoxy to...

WEST SYSTEM 105 epoxy resin is formulated for use with the WEST SYSTEM hardeners. The resin and hardener is combined at a ratio of 5:1 or 3:1 depending on the hardener being used. WEST SYSTEM epoxy can be cured in a wide temperature range to form a...

Use WEST System 205 Fast Hardener at lower temperatures to produce a rapid cure.   WEST System 205 develops its physical properties quickly at room temperature and is designed to be mixed with WEST System 105 Resin in a ratio of 5-parts resin...

Use WEST System 206 Slow Hardener when extended working and cure time is needed.   WEST System 206 develops its physical properties more slowly at room temperature and is designed to be mixed with WEST System 105 Resin in a ratio of 5-parts...

207 Special Clear Hardener has been specially developed for coating applications where a moisture resistant, natural wood finish is desired. 105/207 mixtures resist clouding in humid conditions and exhibit extremely low blush formation – as low as...

WEST System 209 Super Slow Hardener is formulated for general coating and bonding applications in extremely warm and/or humid conditions, or when extended working time is desired at room temperature. WEST System 209 provides approximately twice the...